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Online high-speed dispensing machine

The online high-speed dispensing system uses jetting valve with precise high-speed dispensing and filling. The system realizes smaller dispensing diameter and eliminates the need for Z-axis lifting during operation. Going beyond traditional contact dispensing the product solves the defects such as solder projection uneven glue amount and damage to components and products. In this way work efficiency and product quality are greatly improved.

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Features & Advantages

  • Automatic constant temperature

    Automatic thermostatic system ensures consistent glue fluidity

  • High precision

    Equipped with high-precision weighing system to ensure consistency of glue amount and reduce material waste

  • High jet frequency

    Up to 200~3000 times per second (optional)

  • Small dispensing diameter

    The size of dots can be freely set to achieve smaller dispensing diameter

Features

  • 01
    0-6Bar low pressure operation
  • 02
    Minimum injection volume 0.002μl
  • 03
    Non-contact needleless design
  • 04
    The nozzle is heat resistant and has uniform temperature distribution
  • 05
    Quick-release nozzle design
  • 06
    The fastest injection speed is 3000 times/sec

Application

  • Solder paste spray
  • FPC packaging
  • SMT red paste
  • Silver paste
  • LED packaging
  • Component packaging
  • Surface mount
  • Precision coating
  • Semiconductor chip packaging

Technical parameters

Dimensions L600*W1260*H1380mm
Dispensing area (X/Y/Z)X=300mm Y=400mm Z=50mm
Track load 4kg
X/Y/Z drive mode Servo motor + ball screw
Maximum operating speed 1500mm/S acceleration 2G
Positioning accuracy ±0.01mm
Repeated positioning accuracy ±0.01mm
Weighing system 0.1mg
Rubber valve heating room temperature 0-120℃
Communication interface SMEMA connectable MES management system
Input voltage 220V 50-60HZ
Input pressure 0.6MPa
Total power 3KW
Total weight 390kg

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